Apparatus for continuous assembly of a semiconductor lead frame

Details Apparatus for continuous assembly of a semiconductor lead frame Apparatus for continuous assembly of a semiconductor lead frame

1998-05-07

2000-05-16

Graybill, David E.

Metal working

Barrier layer or semiconductor device making

438112, 438907, 438908, H01L 2100, H01L 2144

Patent

active

060631392

ABSTRACT:
A continuous assembly apparatus comprising means for transporting a lead frame, for adhering a semiconductor chip to a supporting member of the lead frame, for connecting chip electrodes via bonding wires to inner leads of the lead frame, for forming a protective coating on the chip, wire and lead frame, and for separating the inner leads from the supporting member.

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patent: 5249354 (1993-10-01), Richman
patent: 5580466 (1996-12-01), Tada et al.
patent: 5614441 (1997-03-01), Hosokawa et al.
patent: 5756377 (1998-05-01), Ohsawa

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