4. Gear cutting, milling, or planing
  5. Milling
  6. Means to remove scale or raised surface imperfection

Hiroshi Ohtani

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Ceramic substrate for semiconductor package

Stock material or miscellaneous articles – Hollow or container type article – Cellular material derived from plant or animal source
Patent

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Ceramic substrate for semiconductor package and method of manufa

Plastic and nonmetallic article shaping or treating: processes – Including step of generating heat by friction
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Hollow-fiber membrane module

Liquid purification or separation – Casing divided by membrane into sections having inlet – Each section having inlet
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Melt spinning pack and synthetic fiber manufacturing method

Plastic and nonmetallic article shaping or treating: processes – Forming electrical articles by shaping electroconductive...
Reexamination Certificate

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Method of designing dummy wiring

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
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Profile ID: LFUS-PAI-P-267989

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