Ceramic substrate for semiconductor package

Details Ceramic substrate for semiconductor package Ceramic substrate for semiconductor package

1982-06-14

1984-06-26

Thibodeau, Paul J.

Stock material or miscellaneous articles

Hollow or container type article

Cellular material derived from plant or animal source

428 81, 428131, 428192, 428426, B32B 302, B32B 330

Patent

active

044566417

ABSTRACT:
A ceramic substrate for use as a semiconductor package which includes a plate member having an engraved cavity portion on a first face portion thereof and having a rounded corner on a peripheral surface opposite the first face portion and having a first and second stepped crest formed along the edge formed at the boundary of a second face portion opposite said first face portion for increasing impact resistance to chipping and cracking of the ceramic substrate.

REFERENCES:
patent: 4277528 (1981-07-01), Doi et al.

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