4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Die bond

Hiroshi Kirihara

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Punched adhesive tape for semiconductor, method of...

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer
Reexamination Certificate

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Punched adhesive tape for semiconductor, method of...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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Punched adhesive tape for semiconductor, method of...

Cutting – Operation controlled by detector means responsive to work – Actuation of tool controlled in response to work-sensing means
Reexamination Certificate

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Semiconductor device, semiconductor chip mounting substrate,...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Semiconductor device, substrate for mounting semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2098626

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