Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2005-10-04
2008-11-11
Koch, III, George R (Department: 1791)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S252000, C156S256000, C156S269000
Reexamination Certificate
active
07449076
ABSTRACT:
A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.
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English translation of UM 0122305, Duk-Kee Lee, “An Adhesive Tape for a Lead-on-chip and Chip-on-Lead of One United Body Type and An Apparatus for Attaching the Same” May 8, 1998.
Hosokawa Youichi
Iioka Shinji
Kirihara Hiroshi
Nomura Yoshihiro
Tanabe Yoshiyuki
Antonelli, Terry Stout & Kraus, LLP.
Hitachi Chemical Company Ltd.
Koch, III George R
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