Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer
Reexamination Certificate
2007-09-25
2007-09-25
Vo, Hai (Department: 1771)
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Adhesive outermost layer
C428S901000, C428S3550RA, C428S131000
Reexamination Certificate
active
10246620
ABSTRACT:
A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.
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English translation of UM 0122305, Duk-Kee Lee, “An Adhesive Tape for a Lead-on-chip and Chip-on-Lead of One United Body Type and An Apparatus for Attaching the Same,” May 8, 1998.
Hosokawa Youichi
Iioka Shinji
Kirihara Hiroshi
Nomura Yoshihiro
Tanabe Yoshiyuki
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