4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Smart card package

Hideyuki Kurita

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active

BGA package substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Board pieces, flexible wiring boards and processes for...

Metal fusion bonding – Process – With shaping
Reexamination Certificate

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Board pieces, flexible wiring boards, and processes for...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Circuit board and production method thereof

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Flexible board made by joining two pieces through an...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1960548

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