Metal fusion bonding – Process – With shaping
Reexamination Certificate
2005-01-11
2005-01-11
Lam, Cathy F. (Department: 1775)
Metal fusion bonding
Process
With shaping
C228S208000, C428S347000
Reexamination Certificate
active
06840430
ABSTRACT:
A board piece2of the present invention comprises a non-thermoplastic resin film11, a thermoplastic resin film10formed on the non-thermoplastic resin film11and a metal wiring8formed on the surface of the thermoplastic resin film10. Metal wiring8is partially exposed on board piece2to form a contact12. A low-melting metal coating13is formed on contact12and two board pieces2a,2bare pressed against each other under heating with contacts12a,12bthereof being in contact with each other so that thermoplastic resin films10a,10bsoften to adhere board pieces2a,2bto each other and low-melting metal coatings13a,13bmelt and then solidify to connect contacts12a,12bto each other. The region of metal wiring8not used for connection is wiring17connecting contacts12to each other and a cover film19can be provided on the surface thereof. Contacts12a,12bcan also be connected by applying ultrasonic wave.
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Anzai Yukio
Fukuda Mitsuhiro
Kurita Hideyuki
Shinohara Toshihiro
Watanabe Masanao
Lam Cathy F.
Osha & May L.L.P.
Sony Chemicals Corp.
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