Board pieces, flexible wiring boards and processes for...

Metal fusion bonding – Process – With shaping

Reexamination Certificate

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C228S208000, C428S347000

Reexamination Certificate

active

06840430

ABSTRACT:
A board piece2of the present invention comprises a non-thermoplastic resin film11, a thermoplastic resin film10formed on the non-thermoplastic resin film11and a metal wiring8formed on the surface of the thermoplastic resin film10. Metal wiring8is partially exposed on board piece2to form a contact12. A low-melting metal coating13is formed on contact12and two board pieces2a,2bare pressed against each other under heating with contacts12a,12bthereof being in contact with each other so that thermoplastic resin films10a,10bsoften to adhere board pieces2a,2bto each other and low-melting metal coatings13a,13bmelt and then solidify to connect contacts12a,12bto each other. The region of metal wiring8not used for connection is wiring17connecting contacts12to each other and a cover film19can be provided on the surface thereof. Contacts12a,12bcan also be connected by applying ultrasonic wave.

REFERENCES:
patent: 5296649 (1994-03-01), Kosuga et al.
patent: 5714252 (1998-02-01), Hogerton et al.
patent: 6280828 (2001-08-01), Nakatsuka et al.
patent: 6395993 (2002-05-01), Nakamura et al.
patent: 6437251 (2002-08-01), Kurita et al.
patent: 6596947 (2003-07-01), Kurita et al.

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