4. Electrolysis: processes, compositions used therein, and methods
  5. Electroforming or composition therefor
  6. Sheet, web, wire, or filament

Hideyasu Tagusari

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Electrodeposited copper foil for printed wiring board and method

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent

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Electrodeposited copper foil for printed wiring board and method

Electrolysis: processes – compositions used therein – and methods – Electroforming or composition therefor – Sheet – web – wire – or filament
Patent

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Profile ID: LFUS-PAI-P-904247

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