Electrodeposited copper foil for printed wiring board and method

Details Electrodeposited copper foil for printed wiring board and method Electrodeposited copper foil for printed wiring board and method

1998-07-24

1999-04-27

Gorgos, Kathryn

Electrolysis: processes, compositions used therein, and methods

Electroforming or composition therefor

Sheet, web, wire, or filament

205111, 205206, 205222, 205917, C25D 104

Patent

active

058977619

ABSTRACT:
An electrodeposited copper foil for use in the manufacture of a printed wiring board in which the original profile of the matte surface has been completely removed, preferably by buffing, leaving a surface having linear streaks and a roughness 1.5 .mu.m or less. The new surface is then given a nodule forming treatment which produces a surface roughness of 1.5 to 2.0 .mu.m, which may be followed by a corrosion resisting treatment. This invention further provides a method of manufacturing such an electrodeposited copper foil. Such copper foils are especially useful in making fine circuit patterns.

REFERENCES:
patent: 4961828 (1990-10-01), Lin et al.
patent: 5215646 (1993-06-01), Wolski et al.
patent: 5366814 (1994-11-01), Yamanishi et al.
patent: 5437914 (1995-08-01), Saida et al.
patent: 5482784 (1996-01-01), Ohara et al.
patent: 5545466 (1996-08-01), Saida et al.

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