Electrodeposited copper foil for printed wiring board and method

Details Electrodeposited copper foil for printed wiring board and method Electrodeposited copper foil for printed wiring board and method

1997-01-15

1999-01-12

Lam, Cathy F.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428607, 428626, 428658, 428675, 428687, 428935, 205111, C25D 706, B32B 1520

Patent

active

058585176

ABSTRACT:
An electrodeposited copper foil for use in the manufacture of a printed wiring board in which the original profile of the matte surface has been completely removed, preferably by buffing, leaving a surface having linear streaks and a roughness 1.5 .mu.m or less. The new surface is then given a nodule forming treatment which produces a surface roughness of 1.5 to 2.0 .mu.m, which may be followed by a corrosion resisting treatment. This invention further provides a method of manufacturing such an electrodeposited copper foil. Such copper foils are especially useful in making fine circuit patterns.

REFERENCES:
patent: 5215646 (1993-06-01), Wolski et al.
patent: 5437914 (1995-08-01), Saida et al.
patent: 5482784 (1996-01-01), Ohara et al.
patent: 5545466 (1996-08-01), Saida et al.

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