4. Adhesive bonding and miscellaneous chemical manufacture
  5. Methods
  6. Surface bonding and/or assembly therefor

Hideo Yamanaka

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Air-packed CCD images package and a mold for manufacturing there

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Artificial corpus cavernosum device

Surgery – Truss – Perineal
Patent

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Charge-coupled device image sensor

Fishing – trapping – and vermin destroying
Patent

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Charge-coupled device image sensor

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Patent

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Electro-optic device, drive substrate for electro-optic...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-265857

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