Receptacles
Closures
With closure opening arrangements for means
Inventor
active
Conductive substrate with resistance layer, resistance...
Copper foil for chip-on-film use, plasma display panel, or...
Easily openable can lid
Electrodeposited copper foil for fine pattern and method for pro
Process for producing semiconductor device
No associations
LandOfFree
Hideo Otsuka does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Hideo Otsuka, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hideo Otsuka will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-901506