Chemistry: electrical current producing apparatus – product – and – Current producing cell – elements – subcombinations and... – Electrode
Patent
1996-09-18
1998-11-10
Gorgos, Kathryn L.
Chemistry: electrical current producing apparatus, product, and
Current producing cell, elements, subcombinations and...
Electrode
205 57, 205 77, 205296, 428606, 428607, 428612, 428675, 428687, 428935, 429122, 429245, C25D 104
Patent
active
058341404
ABSTRACT:
The present invention is an electrodeposited copper foil characterised in that roughening treatment is performed on a matte side of an untreated copper foil wherein the surface roughness R.sub.z of the matte side of the untreated copper foil is the same as or less than the surface roughness R.sub.z of the shiny side of this untreated copper foil. The electrodeposited copper foil is made by electrodepositing copper onto a drum from an electrolyte which contains 0.05 to 5 ppm 3-mercapto 1-propanesulfonate; at least one organic compound selected from 0.1 to 15 ppm of a polysaccharide which is a carbohydrate such as starches, celluloses and vegetable rubbers, and 0.3 to 35 ppm of a low molecular weight glue having a weight average molecular weight of 10,000 or less; and 10 to 60 ppm of a chloride ion. The copper foil may be used in making a printed circuit board or as a component of a secondary battery cell.
REFERENCES:
patent: 4975159 (1990-12-01), Dahms
patent: 5171417 (1992-12-01), DiFranco et al.
patent: 5215645 (1993-06-01), DiFranco et al.
patent: 5403465 (1995-04-01), Apperson et al.
patent: 5421985 (1995-06-01), Clouser et al.
patent: 5431803 (1995-07-01), DiFranco et al.
patent: 5433840 (1995-07-01), Dahms et al.
patent: 5454926 (1995-10-01), Clouser et al.
patent: 5534129 (1996-07-01), Hoffacker et al.
Otsuka Hideo
Streel Michel
Suzuki Akitoshi
Wolski Adam M.
Circuit Foil Japan Co., Ltd.
Gorgos Kathryn L.
Leader William T.
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