Copper foil for chip-on-film use, plasma display panel, or...

Stock material or miscellaneous articles – All metal or with adjacent metals – Having metal particles

Reexamination Certificate

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Details

C428S606000, C428S607000, C428S626000, C428S658000, C428S675000, C428S687000

Reexamination Certificate

active

10651099

ABSTRACT:
A copper foil for chip-on-film use, a plasma display panel, or a high-frequency printed circuit board obtained by rolling copper foil to smooth the surface to give a surface area of not more than 1.30 times an ideal smooth surface, the smoothed copper foil having deposited on it fine roughening particles of Cu or alloy particles of Cu and Mo or alloy particles comprising Cu and at least one element selected among a group of Ni, Co, Fe, and Cr or a mixture of this alloy particles and oxide of at least one element selected among a group of V, Mo, and W.

REFERENCES:
patent: 5447619 (1995-09-01), Wolski et al.
patent: 5482784 (1996-01-01), Ohara et al.
patent: 5569545 (1996-10-01), Yokono et al.
patent: 5622782 (1997-04-01), Poutasse et al.
patent: 5709957 (1998-01-01), Chiang et al.
patent: 5792333 (1998-08-01), Oguro et al.
patent: 5800930 (1998-09-01), Chen et al.
patent: 5834140 (1998-11-01), Wolski et al.
patent: 5858517 (1999-01-01), Tagusari et al.
patent: 5863410 (1999-01-01), Yates et al.
patent: 5897761 (1999-04-01), Tagusari et al.
patent: 5925451 (1999-07-01), Ohya et al.
patent: 6132851 (2000-10-01), Poutasse
patent: 6248401 (2001-06-01), Chiang et al.
patent: 6269551 (2001-08-01), Imada et al.
patent: 6270648 (2001-08-01), Yates et al.
patent: 6274224 (2001-08-01), O'Bryan et al.
patent: 6426146 (2002-07-01), Ameen et al.
patent: 6475638 (2002-11-01), Mitsuhashi et al.
patent: 6495022 (2002-12-01), Endo et al.
patent: 6569543 (2003-05-01), Brenneman et al.
patent: 6625869 (2003-09-01), Jodo
patent: 6767643 (2004-07-01), Nagai et al.
patent: 6776572 (2004-08-01), Reist
patent: 6808825 (2004-10-01), Nagai
patent: 6847527 (2005-01-01), Sylvester et al.
patent: 2001/0042686 (2001-11-01), Taniguchi et al.
patent: 2002/0182433 (2002-12-01), Endo
patent: 2003/0121697 (2003-07-01), Nagai et al.
patent: 0 709 494 (1996-05-01), None
patent: 0 790 327 (1997-08-01), None
patent: 1 132 961 (2001-09-01), None
patent: 1 331 088 (2003-07-01), None
patent: 2000-294251 (2000-10-01), None
patent: 2002-38226 (2002-02-01), None
patent: 02/24444 (2002-03-01), None
patent: 03/096776 (2003-11-01), None
English Mchine Tranlastion of 2002-038226, Feb. 2002, JP, Tomioka.
Web Publication—Theis Precision Steel Corporation, Surface Condition, Apr. 2001.

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