4. Semiconductor device manufacturing: process
  5. Bonding of plural semiconductor substrates

Hideo Akiya

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Method of forming resist pattern

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Thin film forming apparatus and method

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Patent

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Thin film forming method

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Transferring thin film to a substrate

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Automatic and/or material-triggered control
Patent

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Profile ID: LFUS-PAI-P-974650

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