Transferring thin film to a substrate

Details Transferring thin film to a substrate Transferring thin film to a substrate

1998-02-19

2000-07-25

Mayes, Curtis

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Automatic and/or material-triggered control

156359, 156366, 156382, 156510, 156522, 156540, 156580, 1565831, 438455, B32B 3500, H01L 2130

Patent

active

060925787

ABSTRACT:
A thin film forming apparatus includes a specimen holder on which a substrate for thin film formation is placed, a transfer plate opposing the specimen holder, on which a sheet film having a thin film formed on a surface is placed, a thin film forming chamber comprising the specimen holder and the transfer plate, a pressure unit for moving at least one of the specimen holder and the transfer plate and pressing the specimen holder against the transfer plate for a predetermined time while the substrate and the thin film formed on the sheet film are in contact with each other, a heating unit for heating the substrate at a predetermined temperature, and an exhausting unit for vacuum-exhausting the thin film forming chamber.

REFERENCES:
patent: 4314814 (1982-02-01), Deroode
patent: 4316757 (1982-02-01), Walsh
patent: 4859271 (1989-08-01), Faziln et al.
patent: 5078820 (1992-01-01), Hamamura et al.
patent: 5094709 (1992-03-01), Eichelberger et al.
patent: 5292388 (1994-03-01), Candore
patent: 5445692 (1995-08-01), Nitta
patent: 5558015 (1996-09-01), Miyashita et al.
patent: 5641372 (1997-06-01), Okuno
patent: 5769998 (1998-06-01), Tanzawa et al.

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