4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Insulative housing or support

Hermes T. Apale

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Heat spreader anchoring & grounding method &...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Heat spreader anchoring and grounding method and thermally...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Heat spreader interconnect for thermally enhanced PBGA packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Heat spreader interconnect methodology for thermally...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate

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Mold cap anchoring method for molded flex BGA packages

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2693880

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