4. Electricity: conductors and insulators
  5. Boxes and housings
  6. Hermetic sealed envelope type

Herbert Reichl

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active

Chip arrangement and method of producing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Chip housing

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Flux-free contacting of components

Metal fusion bonding – Process – Plural joints
Patent

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Method for bonding a flexible substrate to a chip

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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Method to prepare the production of structured metal...

Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate
Reexamination Certificate

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Profile ID: LFUS-PAI-P-397622

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