Flux-free contacting of components

Details Flux-free contacting of components Flux-free contacting of components

1996-07-24

1998-11-10

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228254, H05K 334, H01L 2160

Patent

active

058331280

ABSTRACT:
Method of flux-free contacting of components on a substrate, having the following process steps:

REFERENCES:
patent: 3663184 (1972-05-01), Wood et al.
patent: 5112513 (1992-05-01), Bressel et al.
patent: 5173369 (1992-12-01), Kataoka
patent: 5522000 (1996-05-01), Ayliffe et al.
Patent Abstracts of Japan, Sasakii Junichi et al. JP 6196486, Publication te Jul. 15, 1994.
Flip-Chip Bonding on Green Tape Ceramic Substrates, E. Zakel, J. Kloeser, H. Distler and H. Reichl, 9th European Hybrid Microelectronics Conference, pp. 339-350.
Fluxless Flip Chip Assembly on Rigid and Flexible Polymer Substrates Using the Au-Sn Metallurgy, Elke Zakel, Jorg Gwiasda, Joachim Kloeser, Joachim Eldring and Herbert Reichl, Published Sep. 12, 1994 IEEE/CPMT Int'l Electronics Manufacturing Technology Symposum.
Reliability Investigations Fluxless Flip-Chip Interconnections on Green Tape Ceramic Substrates, Joachim Kloeser, Elke Zakel, Franz Bechtold and Herbert Reichl, 45th Electronic Components & Technology Conference, May 21-May 24, 1995, Las Vegas, Nevada, Published 1995.

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