4. Semiconductor device manufacturing: process
  5. Formation of semiconductive active region on any substrate
  6. Fluid growth from gaseous state combined with subsequent...

Hari S. Venugopalan

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Flip chip light emitting diode with micromesas and a...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
Reexamination Certificate

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Flip-chip light emitting diode device without sub-mount

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Flip-chip light emitting diode with a thermally stable...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
Reexamination Certificate

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GaN LED with solderable backside metal

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Fluid growth from gaseous state combined with subsequent...
Reexamination Certificate

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GaN LED with solderable backside metal

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With particular semiconductor material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2706039

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