4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Insulating material

Hans-Hinnerk Steckhan

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Chip cover

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Chip module with heat insulation for incorporation into a chip c

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Semiconductor element and process of manufacturing...

Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – On insulating substrate or layer
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1021074

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