Chip module with heat insulation for incorporation into a chip c

Details Chip module with heat insulation for incorporation into a chip c Chip module with heat insulation for incorporation into a chip c

1998-03-27

2000-06-06

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361749, 361760, 174254, 235492, 257679, H05K 114, G06K 1906

Patent

active

060726989

ABSTRACT:
A heat flow which is introduced into a chip module from the outside is specifically controlled to avoid delaminations between a covering composition and a chip during a hot-melt incorporation process. This takes place either by a heat-insulating layer which is interposed between a flexible carrier tape of the chip module and a chip adhesively fixed thereon, or by clearances within an area or layer of metal contacts. As a result, a heat flow from a hollow punch brought down in an outer region of the metal contacts, in the direction of the centrally mounted chip, is prevented.

REFERENCES:
patent: 4603249 (1986-07-01), Hoppe et al.
patent: 4625102 (1986-11-01), Rebjock et al.
patent: 4755661 (1988-07-01), Ruebsam
patent: 5057460 (1991-10-01), Rose
patent: 5079673 (1992-01-01), Kodai et al.
patent: 5147982 (1992-09-01), Steffen
patent: 5440451 (1995-08-01), Saito et al.
"Rigid Dish Smart Card", IBM Technical Disclosure Bulletin, vol. 32, No. 4A, Sep. 1989.

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