4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With contact or lead

Guoqing Yu

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Wafer level chip size packaged chip device with a...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Wafer level chip size packaged chip device with an N-shape...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Wafer level chip size packaged chip device with an N-shape...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

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Profile ID: LFUS-PAI-P-2347359

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