4. Semiconductor device manufacturing: process
  5. Semiconductor substrate dicing
  6. By electromagnetic irradiation

Gudbjorg H. Oskarsdottir

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Package stress management

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Package stress management

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate

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Polymer device with a nanocomposite barrier layer

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Polymer memory device with electron traps

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Semiconductor wafer coat layers and methods therefor

Semiconductor device manufacturing: process – Semiconductor substrate dicing – By electromagnetic irradiation
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2319952

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