4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Chip mounted on chip

Granville Lee

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Area array stud bump flip chip device and assembly process

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Constraint generating device for logic synthesis and its...

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate

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Semiconductor device and method in which contact hole is...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of...
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Surface mount die by handle replacement

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Patent

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Profile ID: LFUS-PAI-P-1902736

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