Surface mount die by handle replacement

Details Surface mount die by handle replacement Surface mount die by handle replacement

1998-07-07

2000-09-05

Smith, Matthew

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

257734, 257621, 257584, 438411, 438461, 438611, H01L 2348

Patent

active

061147680

ABSTRACT:
A bonded wafer has a first handle wafer 12, a device layer 10', an interconnect layer 14, and a number of vias filled with conductive material that extends between the surfaces 6, 8 of the device layer 10'. the interconnect layer 14 has conductors that connect internal device contacts to the conductive vias. A second handle wafer 40 of glass is bonded to the interconnect layer 14 and the first handle wafer is removed. Bottom, external contacts 36 are formed on surface 6 of device layer 10'.

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patent: 5387555 (1995-02-01), Linn et al.
patent: 5424245 (1995-06-01), Gurtler et al.
patent: 5985728 (1999-11-01), Jennings

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