Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
By pressure alone
Inventor
active
Electronic component and fabrication method thereof
Flip-chip type semiconductor device having recessed-protruded el
Flip-chip type semiconductor device having split voids...
Method of fabricating semiconductor device with bump electrodes
Semiconductor device and flat electrodes
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Profile ID: LFUS-PAI-P-1771258