Flip-chip type semiconductor device having recessed-protruded el

Details Flip-chip type semiconductor device having recessed-protruded el Flip-chip type semiconductor device having recessed-protruded el

1998-04-28

2000-10-24

Jackson, Jr., Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

By pressure alone

257734, 257737, 257739, 257750, 257778, 257780, 257781, 257786, H01L 2348, H01L 2352

Patent

active

06137184&

ABSTRACT:
A flip-chip type semiconductor device comprises a semiconductor pellet having bump electrodes formed on one main surface thereof, a wiring board having pad electrodes formed corresponding to the bump electrodes, the wiring board being disposed opposite to the semiconductor pellet, the bump electrodes contacting the pad electrodes, and a resin for causing the semiconductor pellet and the wiring board to adhere to each other, wherein a convex portion of each of the pad electrodes is press-fitted to each of the pad electrodes. Thus, the connecting strength between a bump electrode and a pad electrode is remarkably improved. Even if the resin between the semiconductor pellet and the wiring board cracks, the press-fitting state between the bump electrode and the pad electrode can be sufficiently kept.

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