4. Chemistry: electrical and wave energy
  5. Processes and products
  6. Coating, forming or etching by sputtering

Gongda Yao

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Aluminum hole filling method using ionized metal adhesion layer

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent

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Barrier applications for aluminum planarization

Semiconductor device manufacturing: process – Including control responsive to sensed condition
Reexamination Certificate

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Barrier applications for aluminum planarization

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Central coil design for ionized metal plasma deposition

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent

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Damage-free sculptured coating deposition

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Reexamination Certificate

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Profile ID: LFUS-PAI-P-579749

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