4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Insulating material

Glenn Lee Kehley

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Electrical connector assembly for connecting first and second ci

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent

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Electronic package with heat transfer means

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Flexible circuitized interposer with apertured member and method

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent

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Flexible circuitized interposer with apertured member and method

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent

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Heat sink structure with corrugated wound wire heat conductive e

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
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Profile ID: LFUS-PAI-P-326613

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