Heat sink structure with corrugated wound wire heat conductive e

Details Heat sink structure with corrugated wound wire heat conductive e Heat sink structure with corrugated wound wire heat conductive e

1995-08-01

1997-09-30

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

2989003, 165 803, 165185, 174 163, 257707, 257713, 361690, 361707, H05K 720

Patent

active

056731779

ABSTRACT:
A heat sink structure with a heat-conducting base and wound wire heat conductors thermally attached to the base for use in electronic packaging structures, e.g., those used in computers. The method of making such a structure, as taught herein, provides a unique structure using wire to form the thermally conductive members in a corrugated shape and aligning these with and thermally coupling to a base structure. In one embodiment, the base structure may be excluded with a heat conductive spacer member used instead.

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