Solid state microwave integrated circuit RF insulator-encapsulat

Details Solid state microwave integrated circuit RF insulator-encapsulat Solid state microwave integrated circuit RF insulator-encapsulat

1995-01-31

1996-11-19

Heinrich, Samuel M.

Metal fusion bonding

Process

Repairing, restoring, or renewing product for reuse

228118, 2281791, B23K 100

Patent

active

055754171

ABSTRACT:
Apparatus and processes for desoldering and soldering an insulator-encapsulated contact using a focused heat source and thermal choke in the form of a soldering iron tip and a contact moat. The desoldering and removal process includes the following steps. Securing the housing to minimize movement thereof. Heating a soldering iron to approximately 825.degree. C. Tinning the tip of the soldering iron with solder and flux. Engaging the contact from the rear using an extraction tool. Disposing flux on the solder joint. Contacting the soldering iron with the contact. Disposing the soldering iron in the moat while outward pressure is exerted with an extraction tool. After a predetermined delay, using the extraction tool to vacuum out the contact, while simultaneously removing the soldering iron and pushing out the contact, whereafter the contact is desoldered and seated in the extraction tool. Removing the contact from the extraction tool and removing the tool from the housing. The soldering or installation process comprises the following steps. Preparing a tinned contact for installation by surrounding its contact pin with teflon sleeves. Disposing flux in a central through hole in the housing. Disposing flux on the solder of the contact. Inserting the contact into the central through hole until one teflon sleeve is engaged therein. Heating a soldering iron to approximately 825.degree. C. Tinning the tip of the soldering iron with solder and flux. Disposing the soldering iron on the contact and pressing the contact into the central through hole. Bottoming out the contact and leaving the soldering iron on the joint for a predetermined time period. Removing the soldering iron and examining the solder joint. Cleaning the solder joint and housing prior to removing the sleeves.

REFERENCES:
patent: 3665367 (1972-05-01), Keller et al.
patent: 4641140 (1987-02-01), Heckaman et al.
patent: 5406122 (1995-04-01), Wong et al.

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