Component assembly

Details Component assembly Component assembly

2008-02-13

2010-11-23

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S673000, C257S704000, C257S773000, C257S685000, C257S787000, C257SE23033, C257SE23068

Reexamination Certificate

active

07838981

ABSTRACT:
The present invention provides a possibility of mounting conventionally capped components, that saves much space. The component assembly includes at least one component having a cap, a substrate for the component and connecting means for mounting the component on the substrate and for the electrical connection of the component. The substrate has at least one recess. The component is mounted on the substrate in flip-chip technique, so that the cap is inserted into the recess and the component is connected to the substrate via connecting bumps in the edge region of the recess.

REFERENCES:
patent: 7633150 (2009-12-01), Shiraishi
patent: 2004/0212069 (2004-10-01), Chen et al.
patent: 2008/0042265 (2008-02-01), Merilo et al.
patent: 101 38 754 (2001-02-01), None

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