4. Semiconductor device manufacturing: process
  5. With measuring or testing

Fred Telecky

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Ball grid package with multiple power/ground planes

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Bonding over integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Bonding pads for integrated circuits having copper...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
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Composite connection structure and method of manufacturing

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
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Dual dicing saw blade assembly and process for separating...

Abrading – Abrading process – Glass or stone abrading
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Profile ID: LFUS-PAI-P-2024286

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