Flip chip technology using electrically conductive polymers and

Details Flip chip technology using electrically conductive polymers and Flip chip technology using electrically conductive polymers and

1989-12-18

1991-12-24

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29832, 156299, 156310, 156315, 174 88R, 437183, C09J 502

Patent

active

050749471

ABSTRACT:
A method is presented for interconnecting bond pads of a flip chip with bond pads of a substrate by an electrically conductive polymer. An organic protective layer is selectively formed over a surface of a flip chip to thereby leave exposed bond pads on the flip chip. Electrically conductive polymerizable precursor is formed on the bond pads extending to a level beyond the organic protective layer to form bumps. The bumps are aligned with bond pads of a substrate and then contacted to those bond pads. The bumps can be polymerized either before or after contacting the bumps to the bond pads of the substrate to form electrically conductive interconnections between the bond pads of the flip chip and the bond pads of the substrate.

REFERENCES:
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Szczepanski, NAS 13-33 77A31551, Elektronika, 17(2), 57-61 (1977), Abstract Only.
Japanese Patent 82176738 (1982). Abstract Only.
Doo, et al., IBM Tech. Dis. Bulletin (USA), 20(4): 1440 (1977).
Kawanobe, et al., In: Proceedings: 31st IEEE Electronic Components Conference, Atlanta (1981).
Delfs, In: Moderne Aufbau -- Und Verbindungstechniken in der Mikroelektronik Proceedings Seminar, Berlin (1982), Abstract Only.
Ginsberg, Electronic Packaging and Production, 25(9): 140 (1985).
Shumay, Advanced Materials and Processes, 130(5): 38 (1986).
Markstein, Electronic Packaging and Production, 27(10): 46 (1987).

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