Francis J. Murdoch

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Insulation of microcircuit interconnecting wires

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder
Patent

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Mechanical acceleration multiplier for microcircuit bond testing

Measuring and testing – Specimen stress or strain – or testing by stress or strain... – By loading of specimen
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Non-destructive semiconductor chip bonding and chip removal

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Profile ID: LFUS-PAI-P-321880

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