Insulation of microcircuit interconnecting wires

Details Insulation of microcircuit interconnecting wires Insulation of microcircuit interconnecting wires

1976-03-25

1977-01-11

Smith, Al Lawrence

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228 18, 118325, 118401, 118420, 425110, 156 51, H01L 2160

Patent

active

040022820

ABSTRACT:
A very-fine microcircuit interconnecting wire is passed through a central ifice in a capillary bonding head of a thermo-compression device which is used for pressing the balled end, or the body, of the microcircuit interconnecting wire to the metallized pads of a hybrid circuit chip. A pair of capillary tubes are moveably attached to the capillary bonding head in such a way that they can be positioned with their orifices opposing each other on opposite sides of the very fine wire just below the central orifice of the capillary bonding head. An insulating adhesive or enamel is passed through the capillary tubes to blend around the wire and form an insulating layer as the capillary bonding head is moved from one bonding point to the next.

REFERENCES:
patent: 867658 (1907-10-01), Hoopes et al.
patent: 2756718 (1956-07-01), Stone et al.
patent: 3222149 (1965-12-01), Drummond
patent: 3643321 (1972-02-01), Field et al.

Affiliated with

Also associated with

Rating

Insulation of microcircuit interconnecting wires does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Insulation of microcircuit interconnecting wires, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Insulation of microcircuit interconnecting wires will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1739876