Non-destructive semiconductor chip bonding and chip removal

Details Non-destructive semiconductor chip bonding and chip removal Non-destructive semiconductor chip bonding and chip removal

1987-01-09

1989-04-04

Buczinski, Stephen C.

357 28, 357 67, 357 80, H01L 2316, H01L 3902, H01L 2356

Patent

active

H00006297

ABSTRACT:
An arrangement and method for mounting IC chips or dice onto substrates crises the use of (a pair of) electrically conductive electrodes placed on a substrate below the location where the IC chip is to be mounted. The electrodes are separated a distance that is approximately equal to the width of the IC chip to be mounted. A resistor material is disposed between the electrodes, or may even be integral therewith. The IC chip is placed above the resistor material, it is insulated from the latter, and it abuts a layer of bonding material (e.g., eutectic solder or epoxy) on its underside. A voltage applied to the electrodes heats the resistor material which, in turn melts or cures the bonding material to thereby secure the IC chip in place on the substrate.

REFERENCES:
patent: 3289046 (1966-11-01), Carr
patent: 4561006 (1985-12-01), Currie

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