LOC semiconductor assembled with room temperature adhesive

Details LOC semiconductor assembled with room temperature adhesive LOC semiconductor assembled with room temperature adhesive

1997-08-14

1998-11-24

Niebling, John

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

156326, H01L 2144, H01L 2148, H01L 2150

Patent

active

058405984

ABSTRACT:
A semiconductor device assembly has a lead frame and a semiconductor device configured to be attached to each other. An adhesive is applied at room temperature through a stencil to the lead frame. The semiconductor device is urged against the adhesive to effect the attachment between the semiconductor device and the lead frame. The adhesive preferably is from about 75 percent to about 95 percent isobutyl acetal diphenol copolymer and from about 25 percent to about 5 percent, respectively, of titanium oxide.

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patent: 5441918 (1995-08-01), Morisaki et al.
patent: 5548160 (1996-08-01), Corbett et al.
patent: 5627108 (1997-05-01), Alibocus et al.

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