4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Feng-Lung Chien

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Circuit probing contact pad formed on a bond pad in a flip...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Flip-chip bumbing method for fabricating solder bumps on...

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
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Method of fabricating solder bumps with high coplanarity for...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method of forming circuit probing contact points on fine...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Process for forming lead-free bump on electronic component

Semiconductor device manufacturing: process – Chemical etching
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2102833

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