4. Optical waveguides
  5. With optical coupler
  6. Particular coupling function

Farrah J. Johnson

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Flip chip dip coating encapsulant

Metal fusion bonding – Process – With protecting of work or filler or applying flux
Reexamination Certificate

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Flip chip dip coating encapsulant

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate

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Method of coating contacts on a surface of a flip chip

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Method of using thin-clad near infrared transparent optical...

Optical waveguides – With optical coupler – Particular coupling function
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2105691

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