Method of coating contacts on a surface of a flip chip

Details Method of coating contacts on a surface of a flip chip Method of coating contacts on a surface of a flip chip

2006-12-18

2009-08-25

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S832000, C029S843000

Reexamination Certificate

active

07578056

ABSTRACT:
A method for encapsulating a flip chip in one step is disclosed. The flip chip is immersed in a polymer bath to apply a coating of the polymer to the surface of the flip chip except for the distal end of the conductive projections on the flip chip electrically conductive pads. The coated flip chip is exposed to ultraviolet light or heat (e.g., IR radiation) so that the coating is at least partially cured.

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