Metal fusion bonding – Process – With protecting of work or filler or applying flux
Reexamination Certificate
2006-12-19
2006-12-19
Edmondson, Lynne R. (Department: 1725)
Metal fusion bonding
Process
With protecting of work or filler or applying flux
C228S180220, C438S118000, C438S127000
Reexamination Certificate
active
07150390
ABSTRACT:
A method for underfilling and encapsulating a flip chip in one step is disclosed. The flip chip is immersed in a polymer bath to apply a coating of the polymer to the surface of the flip chip except for the distal end of the conductive projections on the flip chip electrically conductive pads. The coated flip chip is exposed to ultraviolet light or heat (e.g., IR radiation) to surface cure a skin over the polymer coating. The skin-cured flip chip is placed on a substrate which is then heated to reflow the conductive material from the projections and to cause the polymer from the coating to underfill the flip chip and thermally cure to encapsulate and underfill the flip chip.
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Jiang Tongbi
Johnson Farrah J.
Edmondson Lynne R.
Micro)n Technology, Inc.
Whyte Hirschboeck Dudek SC
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