4. Electricity: electrical systems and devices
  5. Housing or mounting assemblies with diverse electrical...
  6. For electronic systems and devices

Fang-Jun Leu

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Fanless convection cooling design for personal computers

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Flip-chip ball grid array package with a heat slug

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Image sensor packaging structure

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

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Image sensor packaging structure and method of manufacturing...

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Reexamination Certificate

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Packaging structure and method of an image sensor module

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Having light transmissive window
Reexamination Certificate

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Profile ID: LFUS-PAI-P-721290

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