Image sensor packaging structure and method of manufacturing...

Details Image sensor packaging structure and method of manufacturing... Image sensor packaging structure and method of manufacturing...

2007-02-23

2009-06-09

Ghyka, Alexander G (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Including integrally formed optical element

C438S016000, C438S107000, C438S108000, C257SE21499, C257SE21513

Reexamination Certificate

active

07544529

ABSTRACT:
An image sensor module includes a first substrate, a second substrate provided over the first substrate, an image sensor device for receiving an image signal flip-chip bonded to the second substrate, and a semiconductor device for processing the image signal from the image sensor device embedded in the first substrate.

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patent: 5869896 (1999-02-01), Baker et al.
patent: 6833612 (2004-12-01), Kinsman
patent: 2002/0096730 (2002-07-01), Tu et al.
patent: 2004/0056365 (2004-03-01), Kinsman
patent: 2004/0189854 (2004-09-01), Tsukamoto et al.
patent: 2005/0048692 (2005-03-01), Hanada

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