Image sensor packaging structure

Details Image sensor packaging structure Image sensor packaging structure

2005-09-08

2008-08-26

Tran, Minh-Loan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S432000, C257S434000, C257S686000, C257S777000, C257S778000, C257SE31127, C257SE31131, C257SE27144, C257SE27161

Reexamination Certificate

active

07417293

ABSTRACT:
An image sensor module includes a first substrate, a second substrate provided over the first substrate, an image sensor device for receiving an image signal flip-chip bonded to the second substrate, and a semiconductor device for processing the image signal from the image sensor device embedded in the first substrate.

REFERENCES:
patent: 5463229 (1995-10-01), Takase et al.
patent: 5869896 (1999-02-01), Baker et al.
patent: 6833612 (2004-12-01), Kinsman
patent: 2002/0096730 (2002-07-01), Tu et al.
patent: 2004/0056365 (2004-03-01), Kinsman
patent: 2004/0189854 (2004-09-01), Tsukamoto et al.
patent: 2005/0048692 (2005-03-01), Hanada et al.

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