Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1997-02-11
1998-10-20
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257666, 257691, 257692, 257696, 257698, H01L 2312, H01L 2350, H01L 2328
Patent
active
058250840
ABSTRACT:
The present invention discloses a new substrate with two metal layer circuit structure and layout for semiconductor packaging. The speed and performance characteristics of the semiconductor device are optimized while the packaging structure is simplified by utilizing only one dielectric layer and conventional printed circuit board fabrication process. The difficulties encountered due to the complexities and higher cost of production required for the multiple layer and high density configuration are thus avoided. The improved circuit structure is achieved by implementing a segmented ring on one side of a substrate and a split plane on the other side thus forming a single layer substrate structure. The edges of the substrate are coated with metal layer to provide inter-layer connections. In addition to the benefits of high performance, low cost, the improved circuit structure and package layout provide flexibility allowing higher degree of freedom for selecting the location and number of input and output signal lines and connections to the ground and power planes from the semiconductor device.
REFERENCES:
patent: 4638348 (1987-01-01), Brown et al.
patent: 5006792 (1991-04-01), Malhi et al.
patent: 5672909 (1997-09-01), Glenn et al.
Chen Kuan Luen
Chen Yung Shih
Chou Tai-Yu
Koh Wei H.
Lau John H.
Express Packaging Systems, Inc.
Lin Bo-In
Thomas Tom
Williams Alexander Oscar
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