4. Metal fusion bonding
  5. Process
  6. Plural joints

Eugene T. Selbitschka

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Direct application of unpackaged integrated circuit to flexible

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Direct application of unpackaged integrated circuit to flexible

Metal fusion bonding – Process – Plural joints
Patent

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Metallized laminate material having ordered distribution of cond

Stock material or miscellaneous articles – Structurally defined web or sheet – Including aperture
Patent

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Profile ID: LFUS-PAI-P-45546

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