Direct application of unpackaged integrated circuit to flexible

Details Direct application of unpackaged integrated circuit to flexible Direct application of unpackaged integrated circuit to flexible

1993-06-23

1994-09-20

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361736, 361748, 361751, 361762, 439 55, 174 524, 174263, 22818022, H05K 100

Patent

active

053495004

ABSTRACT:
An apparatus is described for electrically connecting flip chips to a flexible printed circuit substrate. The apparatus comprises (1) providing solder paste to a plurality of active contact pads located on the flexible printed circuit substrate, (2) placing the flip chips on the substrate such that solder bumps located on the flip chips are in registration with the solder paste on the active contact pads, and (3) heating the resulting assembly as a whole so that the solder paste on each active contact pad fellows to form an electrical connection with its corresponding solder bump.

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